NCG - Process Integration Engineer

NCG - Process Integration Engineer

ON Semiconductor

Roznov pod Radhostem, Czech Republic

JOB DESCRIPTION

• Introduction of new processes and technologies into semiconductor manufacturing with an emphasis on the final parameters of semiconductor chips. For Si and SiC technologies;
• Design, develop and qualify semiconductor wafer fabrication processes on SiC substrates;
• Develop, maintain and improve unit process modules specific for SiC substrates;
• Track and disposition engineering material in the Fab;
• Design and supervise critical experiments, analyze data and evaluate results into written conclusions;
• Identify key technology gaps and lead cross-functional teams to address them.

QUALIFICATIONS

• Master Degree or PhD in Electrical Engineering, Materials Engineering, Chemistry or Physics;
• Knowledge of microelectronics and semiconductor physics;
• Knowledge of electrical characterization of semiconductor devices preferred;
• Experience with TCAD and finite element method computation optional;
• Enterprising, Self-reliant and Flexible;
• Advanced in English, written and spoken.

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