Head of Hardware Design

Ericsson

Rosenheim, Germany

This role will be part of the EAS R&D Leadership Team, shaping the future of our technology and innovation strategy. As a senior leadership position, it offers a unique opportunity to directly influence technology direction, drive system performance excellence, and strengthen our overall business competitiveness. You will lead the team of over 100 people. The role is based in Rosenheim, Germany.

You will be responsible

Lead and develop a unit which is ultimately responsible for antenna design of base station antennas, embedded, and interleaved antenna systems;
Provide design responsibility and functional leadership in the fields of RF design, mechanics and electronics;
Lead by example as a visible role model, providing regular coaching and structured mentoring to develop leaders, elevate team performance, and ensure succession readiness across the organization;
Lead technology development with the clear ambition of continued technology leadership and cost-optimized system solutions;
Drive continuous optimization of design methodology with a focus on digital development methodologies including AI and embedded design to cost and value engineering;
Drive systematic and strategic resource development, both on skill and competence but also on strategic scope influencing;
Own and execute continuous improvement on productivity and efficiency in strong collaboration with operational entities and partner networks;
Close collaboration and continuous process improvement within all lines of R&D and Operations (such as Systems, Industrialization, Sourcing, ...);
Build and improve strong operative and strategic relationships with internal and external R&D partners.

You will bring

Proven track record in leading and developing large organizations, including leading leaders and successful transformation of engineering departments;
Product Development expertise;
Experience within the hardware industry with a sound understanding across the value chain from technology to design and over to supply;
Demonstrated international experience and track record in design leadership for hardware products and/or solutions, always passionate to target the best value per cost;
Transformation experience;
Knowledge and experience in one of the fields of mechanical, RF - manufacturing engineering is a plus;
Strong interpersonal, communication and presentation skills, able to successfully interact on all levels up to senior/executive management;
Highly analytical and methodical approach with strong problem-solving skills;
Proficiency in written and spoken English language;
A Master´s or University degree in telecommunications, engineering, technology, or an equivalent qualification.