Failure Analysis Engineer

Failure Analysis Engineer

ADI - Analog Devices

Limerick, Ireland

A position is currently available in the Quality Group for a Failure Analysis Engineer, responsible for supporting new product development, fabrication yield improvements and process transfer, as well as failure analysis tools and techniques. The job will entail working closely with internal teams to support development process cycles of Integrated Circuits, using a wide variety of materials characterisation & failure analysis techniques.

Failure Analysis Engineers Responsibilities include, but not limited to:

• Support Reliability of ADI’s IC (Integrated circuit) portfolio of products for qualification and release.
• Resolving FAB Yield, Process & Product transfer issues by applying FA methodologies.
• Liaise with design, product, reliability, and FAB engineers (both local and globally) to efficiently and accurately analyse new development products and provide analysis/characterisation support.
• Develop new methodologies for the analysis and inspection of new Technology.
• Routine use of electrical bench test setups and fault localisation systems (Thermal, LEM, OBIRCH).
• Perform physical analysis with inspection techniques such as X-ray, FIB, SEM, EDX, TEM, XPS, optical, mechanical polishing, broad ion beam polishing, wet chemical etching, plasma etching etc.
• Compiling reports for large interdisciplinary audiences (Quality, Design, Sales, Marketing and FAB process engineers etc.).
• Assist in maintenance of lab-based tools (Fault localisation systems, sample preparation & inspection tools) to ensure system uptime and efficiency. Leasing with vendors and support teams for development of tool techniques.
• Drive Continuous Improvement through lean manufacturing & problem-solving activities.
• Showcase new FA analysis/characterisation developments at both internal level (ADI conferences and project meetings) in addition to external level (international conferences etc.).

Qualifications:

• BSC/BEng in Electronic Engineering, Physics, or related discipline with 3 to 5 years relevant industry experience.
• Knowledge of FAB processes & ‘More than Moore Technology’.
• Ability to analyse ATE/yield results and interpret die level schematic/layout.
• Strong problem-solving skills with an aptitude for hands-on work; Semiconductor/materials-analysis and characterisation experience would be a distinct advantage.
• Broad knowledge of semiconductor/materials characterisation techniques including characterisation systems, features and functionality.
• Excellent organisation and communication skills (including interdisciplinary communication skills).
• Training will be provided as required on hiring.