Process Engineer - PCB Assembly

Process Engineer - PCB Assembly

EnduroSat

Sofia, Bulgaria

What is the role?

As Process Engineer you will actively participate in the PCB design process, providing expert feedback on layout, component selection and other factors that impact manufacturability. You will plan, implement, commission, operate, maintain, and continuously optimize the systems that power our manufacturing, working closely with suppliers, system integrators, and internal stakeholders. Your work will ensure safe, reliable, and efficient operations, enabling high-quality and scalable satellite production.

Some of your daily tasks will include:

• Run formal DFM reviews; deliver redlines and risk-ranked actions covering:
• • Land pattern compliance (IPC 7351), BGA/LGA/QFN/BTC rules, NSMD vs SMD pads;
  • Via strategy (via-in-pad fill/cap per IPC 4761, thermal via arrays), microvia/HBI reliability;
  • Solder mask and legend clearances, paste mask optimizations, step-stencil needs;
  • Assembly keep-outs, AOI/AXI accessibility, fiducials (global/local), tooling holes, panelization/rails/breakaways;
  • Copper balance, thermal reliefs, warpage control, component spacing for placement/rework.
• Work closely with design engineers, manufacturing partners and quality assurance teams to resolve design and manufacturing challenges;
• Ensure that all PCB assembly processes and products adhere to the highest industry standards for space applications, including IPC-A-610 Class 3;
• Create and maintain comprehensive process and DFM documentation;
• Collaborate with external manufacturing partners to ensure they meet EnduroSat's quality and technical requirements;
• Identify opportunities for continuous improvement in the PCB assembly process to enhance efficiency, reduce costs and improve product reliability;
• Actively participate in root cause analysis of manufacturing defects and implement effective corrective and preventive actions.

What do we look for?

• Bachelor’s degree in electrical engineering, manufacturing engineering or related;
• Minimum 5 years hands-on PCB assembly manufacturing experience with complex, high reliability boards;
• Proven DFM leadership from schematic through release; strong PCB layout review skills;
• In-depth knowledge of SMT and through-hole assembly processes and equipment;
• Strong command of IPC standards: IPC A 610 Class 3, IPC A 600 Class 3, J STD 001 (Space Addendum);
• Familiarity with materials and processes used in high-reliability electronics for harsh environments;
• Experience with CAD tools for PCB layout review.