Thermal Management Engineer

Thermal Management Engineer

RINA

Rome, Italy

Mission

We are looking for a Junior Thermodynamic Analyst with a passion for thermal analysis of PCBs (Printed Circuit Boards).

The ideal candidate will have a solid theoretical background in thermodynamics and heat transfer, and have completed university or industry projects that demonstrate the ability to apply this knowledge to practical cases.

Key Accountabilities

• Perform basic thermal analysis of PCB boards using simulation software (CFD, FEM, or specific for the thermal analysis of electronic boards);
• Work with the design team to identify and resolve overheating issues;
• Develop and implement thermal management solutions under the supervision of a senior;
• Prepare technical reports and present the results of the analysis;
• Learn and apply the latest technologies and methodologies in the field of thermodynamic analysis.

Education

• Bachelor’s Degree in Engineering General;
• Master’s Degree in Mechanical Engineering or Electronics.

Skills

• Knowledge of thermodynamics, heat transfer and fluid dynamics principles;
• Experience with thermal simulation software (also at academic level);
• Ability to interpret technical data and write clear and concise reports;
• Excellent problem solving skills and teamwork attitude;
• Knowledge of technical English.

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