Process Integration Engineer TSV

Process Integration Engineer TSV

Temporary Position

ams OSRAM

Premstätten, Austria

What we expect

• PI (process integration) representative for TSV (Through-Silicon-Via) technology
• Supervise and monitor manufacturing of the process technology in close teamwork with single process engineering, process R&D, QA, etc.
• Maintain process deliveries (e.g. FMEA, PCP, etc.) and lead cross-functional discussions
• Optimize processes and solve process problems in close teamwork with different departments (e.g. Test, Product Engineering, Design, Design Support, QA, etc.)
• Evaluate and implement possible process simplifications/improvements in order to lower manufacturing costs and increase process and product robustness
• Improve product yield via defect engineering perform physical failure analyses in close cooperation with other departments / teams (e.g. defect, FA team, etc.)

Who we are looking for

• Master degree or PhD in Physics, Chemistry or Material Sciences
• High organizational and communication skills
• Ability to work independently and self-consciously
• Advanced problem solving skills (beneficial: Six Sigma experience, etc.)
• Ability to lead cross-functional teams and willingness to work in a team environment
• Ability to adjust to fast changing environments and project working style to set up new processes
• Confident writing and speaking ability in English
• Beneficial: experience and mind-set according automotive standards in semiconductor industry
• Beneficial: experience in technical issue solving in 8D format

Apply Now