FEA Simulation Engineer - Sensor Assembly R&D

FEA Simulation Engineer - Sensor Assembly R&D

ams OSRAM

Premstätten, Austria

What we expect

• Reliability simulation and risk assessment of optical sensor packages with focus on thermal and (thermo-)mechanical design
• Process modelling of critical packaging assembly steps
• Calibration and validation of simulation by experiment
• Technical lead of package simulation project tasks
• Development/improvement of simulation and back-end material characterization techniques
• Coordination of characterization of new materials and implementation of results in database
• Interface with package design, materials development, quality, and project teams

Who we are looking for

• Advanced university degree in Physics, Chemistry, Materials Science, Optics, Polymer/Mechanical/Semiconductor Engineering, or related fields
• 5+ year experience in continuum mechanics, modelling and FE simulation (COMSOL, Ansys, Abaqus)
• Experience in thermal and thermo-mechanical analysis of materials and constitutive modelling
• Basic knowledge of semiconductor package processes, as well as MEMS and CMOS manufacturing technologies is a benefit
• Experience in fracture mechanics / PoF or CFD modelling is a benefit
• CAD software skills are a benefit
• Demonstrated analytical and problem-solving skills
• Ability to translate complex problem statements into targeted solution-oriented simulation approaches
• Ability to work in & collaborate with diverse teams in multiple geographical locations
• Strong communication skills
• Fluent English

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